NYSE
37.08USD
-2.38 (-6.04%)
We have scored 25 news catalysts on ASE Technology Holding Co., Ltd. (ASX) over the past 12 months. The biggest single-day move next to one of them came Jul 30, 2026, when ASX closed +11.7%: “ASE Technology Q2 Earnings Call Highlights”. Coverage across the window leans positive (average ticker sentiment +0.70). Most of the impact sits in revenue growth rate and forward growth expectations.
Dots are scored news catalysts — size = impact, color = sentiment. Tap one to read it.
Market cap
81.5B
P/E
—
EPS
—
Beta
1.46
52W range
10.93-45.52
Day range
36.68–37.88
Open
37.88
Prev close
39.47
Volume
10.6M
Avg volume
9.6M
Dividend
0.40
IPO
2000-10-02
Daily OHLCV with SMA overlays and session pivots. Draw your levels and trendlines on it, or ask the AI analyst what the price is reacting to.
Suppliers, customers, partners and competitors, derived from what the news actually says about ASE Technology Holding Co., Ltd. — not a sector bucket. Click an edge to see the articles that established the link.
Latest scored catalyst for ASX: .
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Established in 1984 and headquartered in Kaohsiung, Taiwan, ASE Technology Holding Co., Ltd. operates as a leading global provider of essential services for the semiconductor industry. Its primary business encompasses a full range of semiconductor packaging and testing solutions, alongside electronic manufacturing services, catering to an international clientele spanning the United States, Taiwan, various other Asian countries, and Europe. The company offers an extensive portfolio of packaging services, featuring advanced techniques such as flip chip ball grid array (BGA) and chip scale package (CSP) formats. This also includes a variety of quad flat packages (including low profile and thin versions), bump chip carriers, and advanced quad flat no-lead (QFN) packages. ASE specializes in cutting-edge solutions like plastic BGAs, 3D chip packages, and stacked die integration, utilizing both copper and silver wire bonding. Further sophisticated offerings include specialized flip chip BGAs with heat-spreaders, hybrid FCCSPs, innovative package in package (PiP) and package on package (PoP) assemblies, advanced single-sided substrates, high-bandwidth PoP, fan-out wafer-level packaging, SESUB technology, and 2.5D silicon interposers. Additionally, the company produces IC wire bonding packages, system-in-package (SiP) products and modules, and provides critical interconnect materials, including the assembly of electronic components for the automotive sector. In the domain of semiconductor testing, ASE delivers a comprehensive array of services. These range from initial front-end engineering testing and wafer probing to the final verification of a diverse set of components, such as logic, mixed-signal, radio frequency (RF) modules, SiP, micro-electro-mechanical systems (MEMS), and discrete devices. The company also manages associated test services and drop shipment logistics. Beyond its core semiconductor operations, ASE Technology Holding diversifies its ventures significantly. This includes the development, construction, sale, leasing, and management of real estate properties. The company also manufactures substrates, offers information software solutions, provides equipment leasing and investment advisory services, and manages warehousing operations. Furthermore, ASE is involved in processing and distributing computer and communication peripherals, electronic components, telecommunications equipment, and motherboards, actively participating in the import and export of goods and technology.
