NASDAQ
89.47USD
-1.08 (-1.19%)
We have scored 28 news catalysts on Aehr Test Systems (AEHR) over the past 12 months. The biggest single-day move next to one of them came Jul 15, 2026, when AEHR closed +21.9%: “AEHR stock explodes 40%: could it be a hidden winner of Nvidia's AI boom?”. Coverage across the window leans positive (average ticker sentiment +0.50). Most of the impact sits in price momentum and forward growth expectations.
Dots are scored news catalysts — size = impact, color = sentiment. Tap one to read it.
Market cap
2.9B
P/E
—
EPS
—
Beta
3.07
52W range
18.7-147.4
Day range
87.15–92.54
Open
92.02
Prev close
90.55
Volume
815.3K
Avg volume
2.6M
Dividend
0.00
IPO
1997-08-15
Daily OHLCV with SMA overlays and session pivots. Draw your levels and trendlines on it, or ask the AI analyst what the price is reacting to.
Suppliers, customers, partners and competitors, derived from what the news actually says about Aehr Test Systems — not a sector bucket. Click an edge to see the articles that established the link.
Latest scored catalyst for AEHR: .
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Aehr Test Systems, founded in 1977 and based in Fremont, California, specializes in the global provision of advanced burn-in and test systems for integrated circuits, encompassing logic, optical, and memory devices. Its extensive product lineup includes the ABTS and FOX-P families of test and burn-in solutions, complemented by specialized components such as the FOX WaferPak Aligner, FOX-XP WaferPak Contactor, FOX DiePak Carrier, and FOX DiePak Loader. The ABTS system is specifically designed for both production and qualification assessments of packaged parts, covering a range of lower and higher power logic devices, as well as various memory types. For more complex integrated circuits like memories, digital signal processors, microprocessors, microcontrollers, systems-on-a-chip, and integrated optical devices, the FOX-XP and FOX-NP systems facilitate burn-in and functional testing at both the wafer and individual die/module levels. Aehr's FOX-CP system offers a compact, single-wafer solution for verifying the reliability of logic, memory, and photonic devices. A distinguishing offering, the WaferPak Contactor, features an exclusive full-wafer probe card, accommodating wafers up to 300mm, which enables semiconductor manufacturers to conduct comprehensive wafer-level testing and burn-in on Aehr's FOX platforms. Furthermore, the DiePak Carrier provides a reusable, temporary packaging medium, empowering IC manufacturers to complete final testing and burn-in processes for bare die and modules.
